Mobile CPU chip

Features:
  • Mainly used in MiFi/mobile phone

  • Supporting: LTE CAT4, LTE-FDD2100/1800MHz,
    LTE-TDD2600/2600MHz, EVCO800MHz, WCDMA,
    UMTS2100/1900/850MHz, EGPRS/GSM850/900/1800/1900MHz

  • Compatible with global main-stream 2G/3G/4G network

  • Cross telecom-operators support

  • RAM can be extended to 32G

  • Supports connection of up to ten devices

  • Network Broadband up to 100M

Mobile CPU chip

Relevant parameters:
  • Technology:SMIC28PS

  • Die size (post-shrink):6.9 mm x 5.4 mm

  • Total instance number:Over 8 million

  • Total memory instance:over 1.2K

  • Total memory bits:30Mbit

  • Max core logic frequency:800MHz

  • Major blocks:
    - WD(WCDMA)
    - TD(TD_LTE)
    - LTE(LTE module)
    - ZSP(CPU)
    - R7(CPU,800MHz)
    - DDR(1GHz LPDDR2/3 PHY, Innosilicon IP)
    - USB2 PHY, Innosilicon IP
    - HSIC PHY, Innosilicon IP
    - Temperature Sensor, Innosilicon IP


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